中文摘要：

针对硅片研磨和抛光产生的亚表面损伤层会影响栽流子寿命及界面态的特点，采用机械减薄、机械抛光、化学机械抛光（CMP）制备出不同粗糙度的样品。通过傅里叶红外透射谱分析和C—V测试分析表明，粗糙度大的硅片表面因表面损伤大，具有更低的红外透射率和更高的界面态密度。

英文摘要：

The sub-surface damage layer generated by grinding and polishing may effect the carrier lifetime and interface states of the silicon surface. Several samples for different roughness are fabricated by mechanical thinning, mechanical polishing and chemical mechanical polishing （CMP） processing in this paper. The Fourier transform in-frared transmission spectroscopy and C-V test are used to analyze the samples. The results show that the higher the roughness of the silicon surface is, the lower the infrared transmittance and the higher density of interface states wilt be.