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Thermal-Aware Small-Delay Defect Testing inIntegrated Circuits for Mitigating Overkill
  • 期刊名称：IEEE Trans. Computer-Aided Design
  • 时间：2016.3.1
  • 页码：499-511-
  • 相关项目：数字系统小延迟缺陷诊断及测试- - 理论与方法
作者： K. Shen|B.B. Bhattacharya|X.Wen|X.Lin|
同期刊论文项目
数字系统小延迟缺陷诊断及测试- - 理论与方法
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