中文摘要：

采用金相显微镜（OM）、扫描电镜（SEM）、能谱仪（EDS）等表征了材料的失效特征以及裂纹附近材料与基体材料的组织结构与性能等。结果表明：镶块发生开裂的主要原因是V系碳化物在晶界处的偏聚或形成了链状碳化物,导致其冲击韧性偏低。

英文摘要：

By using optical microscope （OM）, scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS）, microhardness tester characterized the failure characteristic and microstructure and properties of the material nearing the crack and the matrix material. The results shows that the main cracking reason of the hot stamping b-pillar die insert is that vanadium carbide segregated on grain boundary or formed chain carbide.