采用真空扩散焊在不同焊接温度下对AZ31B镁合金和6061铝合金进行连接。利用光学显微镜(OM)、扫描电镜(SEM)和能谱(EDX)观察Mg/Al异种金属接头的显微组织。结果表明:随着焊接温度的升高,扩散区各层的厚度增加,且组织发生明显变化。440°C时扩散层由Mg2Al3层和Mg17Al12层组成;460和480°C时由Mg2Al3层、Mg17Al12层和Mg17Al12与镁基固溶体的共晶层组成。随着加热温度的升高,高硬度区域显著增多,区域内不同位置的硬度存在明显差别。当焊接温度为440°C时接头的最大抗拉强度为37MPa,脆性断裂发生在Mg17Al12层。
The joining of AZ31B Mg alloy to 6061 Al alloy was investigated at different joining temperatures by vacuum diffusion bonding method. The microstructures of Mg/Al dissimilar joints were studied by means of optical microscopy (OM), scanning electron microscopy (SEM) and energy dispersive X-ray (EDX). The results show that the thickness of each layer in the diffusion zone increases with the increase of joining temperature, and the microstructure changes obviously. At joining temperature of 440 °C, the diffusion zone is composed of Mg2Al3 layer and Mg17Al12 layer. At joining temperatures of 460 and 480 °C, the diffusion zone is composed of Mg2Al3 layer, Mg17Al12 layer, eutectic layer of Mg17Al12 and Mg-based solid solution. The width of high-hardness zone in the joint increases with increasing joining temperature, and the micro-hardnesses at different locations in the diffusion zone are significantly different. The joining temperature of 440 °C offers the highest tensile strength of 37 MPa, and the corresponding joint exhibits brittle fracture at the intermetallic compound layer of Mg17Al12.