中文摘要：

在像增强器制备过程中,转移阴极—铟封技术使器件设计更加自由,并能提高器件的增益及时间、空间分辨率。相对于冷压铟封,热铟封技术更加简单实用,设备造价低,因此,在真空光电器件制备领域有着广泛的应用前景。但是,热铟封技术在保证器件气密性方面仍需进一步改善。本文采用真空蒸镀方式,在玻璃上制备了多层金属薄膜,以提高In-Sn合金与玻璃的润湿性能。采用座滴法比较了合金在玻璃及五种膜层结构表面的润湿及铺展性能。利用JSM-6700F型场发射电子扫描显微镜分析了润湿界面特性。结果表明：In-Sn合金与玻璃的润湿性能差,且在封接界面处容易产生孔洞;In-Sn合金在膜层结构玻璃/Cr/Cu和玻璃/Cr/Ni/Cu/Ag上表现出良好的铺展性和润湿性,在封接界面处,合金与薄膜表层结合致密,无缝隙或孔洞出现;器件铟封实验表明,采用膜层结构玻璃/Cr/Ni/Cu/Ag,热铟封制管成品率高,气密性良好。

英文摘要：

The paper addressed the enhancement of wettibility of In-Sn alloy on the glass surface,modified with the different multi-layers of Cr,Ni,Cu and Ag,grown by electron beam evaporation.The interfacial microstructures and the wettibility of In-Sn alloy on the glass were characterized with scanning electron microscopy.The results show that the microstructures of the multi-layer improve the wettibility and spreadability of In-Sn alloy on glass to a varying degree.We suggest that the glass covered with Cr/Ni/Cu/Ag multilayered films outperform that modified with other 4 types of multilayers in thermal indium sealing-better air-tightness and higher rate of the finished products.