中文摘要：

采用复合络合剂．柠檬酸钠和乳酸，通过正交试验优化了化学镀Ni—Co-P工艺，并对镀层的形貌、成分、组织结构及性能进行了检测和分析。结果表明，优化后的化学镀Ni-Co-P镀液稳定性好，镀速高；所得镀层为纳米晶结构，晶粒尺寸在40～60nm，具有Ni（Co）（111）取向，整个热处理过程中晶粒没有明显长大，在428℃左右镀层发生重结晶，析出Ni3P相；镀层硬度HV10为8867MPa，在400℃处理后HV10可提高至9892MPa：镀层矫顽力Hc为556．27×79．6A／m，饱和磁化强度坛为48．73（A·m^2）／kg，整个热处理过程中，镀层磁性参数变化不大。镀层具有良好的热稳定性。

英文摘要：

In this paper, the electroless Ni-Co-P plating solution was stabilized using two eomplexing agents, sodium citrate, and lactic acid. Furthermore, bath and operation parameters were optimized by orthogonal experiment. Then, the morphology, composition, microstructures and properties of the coatings were detected and analyzed. It was found that the optimized plating solution was stable and of high plating rate. The as-plated Ni-Co-P films had a grain size of 40-60 nm and strong Ni（Co） （111） orientation. During heat treatment, the grain didn＇t grow obviously, recrystallization occurred at 428 ℃, in which Ni3P separated out. The hardness HV10 of the as-plated coatings was 8867 MPa and increased to the maximum 9892 MPa after heated at 400 ℃ for 1 h. The coercivity （H0 was 556.27×79.6 A/m and saturation magnetization （Ms） was 48.73 （A·m^2）/kg. The values of the Hc and Ms didn＇t change obviously during heat treatment. The Ni-Co-P film show excellent thermal stability.