中文摘要：

预成型焊片的润湿性直接关系到光电子封装的可靠性。常用的焊料润湿性评价方法对于评价预成型焊片润湿性具有很大局限性。提出了一种动态测试焊料润湿性的方法,并设计了一套测试系统。通过铺展面积与时间的关系曲线得出最大铺展面积、润湿时间、平均润湿速度和瞬时润湿速度等特征参数,对预成型焊片的润湿性进行评价。实验表明,该润湿性动态测试系统能够方便地获得铺展面积与时间的关系曲线,从中可得出不同预成型焊片在特定环境下润湿性的变化规律,也说明了该动态测试方法的可行性。

英文摘要：

The wettability of solder preforms will have a direct relationship with the reliability of optoelectronic packages.The current evaluation of the solder wettability has significant limitation to apply in the solder performs.Put forward an innovative dynamic wetting test method,and design a testing system.The spreading area-time curve can be obtained by the method.Some characteristic parameters such as maximum spreading area,wetting time,average spreading speed and instantaneous spreading speed can be reached to evaluate the wettability of solder preforms through the curve.Experiments show that the dynamic wetting testing system can easily get the spreading area with the time curve and the variation of wettability of different solder preforms in a particular environment can be known,and the feasibility of the dynamic test method has also been proved.