中文摘要：

针对实际应用DSP系统时常见的电源干扰、传输线效应和强电干扰等问题,对电子产品电磁环境进行分析,根据电磁干扰产生的机理和影响,对DSP系统提出了电磁兼容性设计要求。从元器件的布置,地线和电源线的布置,信号线的布置三个方面给出电路板的设计方法,从而有效降低DSP系统的干扰,提高电磁兼容性能。这些技术从设计层次上保证了高速DSP系统的有效性和可靠性。

英文摘要：

In order to reduce the common power interference, transmission line effect and high voltage interference on DSP system, the electromagnetic environment of electronic products is analyzed. Some requirements to electromagnetic compatibility （EMC） design are proposed according to the mechanism and influence of the electromagnetic interference （EMI）. The method of PCB design is offered in the aspects： the component, the ground wire, power wire and signal wire arrangements, which effectively reduce the interference of DSP system, improve EMC, and ensure the validity and reliability of the highspeed DSP system at the design level.