大量化学药品并且高度净化水被需要 inmicroelectronic 制造。当半导体设备的特征尺寸曾经减少到 nanoscaledimensions 和综合电路( IC )的功能的复杂性,答案的能力将显著地成为质问的更多渗透微小的空格 increases.Supercritical 液体( SCF )拥有能潜在地是的性质(没有表面紧张象andgas一样粘性)的唯一的联合在响应对清洗系统,小尺寸的发展中溶剂,和低化学使用的进程的材料兼容机的需要生产并且处理的微电子学为申请利用了。为有图案的多孔的 low-k 电介质清洗并且清洗并且在基于 CO_2 的溶剂光致抗蚀剂弄干的最近的微电子学过程是这评论的主要焦点。在超级批评液体处理的另外的话题包括光致抗蚀剂,有 nanoscale 尺寸的发展,金属免职和 silylation 的旋转涂层。
Large amount of chemicals and highly purified-water are needed in microelectronic manufacture. The ability of solutions to penetrate tiny spaces will become significantly more challenging as the feature size of semiconductor devices decreases to nanoscale dimensions and the functional complexity of Integrated circuitries (ICs) ever increases. Supercritical fluids (SCFs) possess a unique combination of properties (no surface tension and gas-like viscosity) that can potentially be exploited for application in microelectronics manufacturing and processing in response to needs for material-compatible cleaning systems, small-dimension developing solvents, and low chemical-use processes. Recent microelectronics processes for cleaning and rinsing of patterned porous Iow-k dielectrics and drying of photoresist in CO2-based solvents are the main focus of this review. Additional topics in supercritical fluid processing include spin coating of photoresists, development with nanoscale dimensions, metal deposition and silylation.