中文摘要：

采用光固化模塑法代替传统的芯片加工方法,用液体光固化材料代替传统的热塑性高分子材料以及玻璃和硅等无机材料,研究了一种微流控芯片的快捷、低成本制作方法;同时研制出了适用于光固化材料芯片的键合方法。对键合后的芯片进行检验,实验结果表明,光固化模塑成型的微流控芯片流道精度高、完整性好、通畅度佳;芯片透光性良好,红外光及紫外光透过率分别达94%和24%;在芯片的混合流道内能形成水包油的液滴。整个制造过程能够满足微流控芯片批量化生产的要求,且相应的生产设备造价不高,降低了微流控芯片的制作成本。

英文摘要：

A light cured resin, monomer, and photoinitiator agent have been employed as a replacement for tradi- tional polymer materials such as glass and silicon to provide a low-cost, fast process for the fabrication of microfluid- ic chips, giving a light curing molding method rather than the traditional chip processing method. A bonding meth- od suitable for light curing material chips has been developed at the same time. Tests showed that the reproducibili- ty, consistency and patency of the obtained runner are good. The results also show that the chip has good transmit- tance, with the infrared and ultraviolet transmissivity being 94% and 24% respectively, and droplets of oil in water are formed in the mixed channel of the chip. Since the method has low materials requirements and the manufactur- ing cost, it can meet the needs of mass production.