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中文摘要：
利用MSC.Marc有限元分析软件对低合金高强度钢厚板打底焊热过程进行数值模拟,从温度场角度分析坡口预留间隙大小对焊缝根部熔合的影响,并通过焊接试验对模拟结果进行验证和补充.结果表明,在低合金高强度钢要求的焊接热输入下,当预留间隙小于2 mm时,打底焊缝根部出现未熔合或未焊透缺陷;当预留间隙增大到2-4 mm时,打底焊缝根部熔透,焊缝成形良好;当间隙增大到5 mm以上后,热源不足以熔化较多的侧壁母材金属,可能出现未熔合,实际焊接时需要采用大热输入摆动才能熔合良好.
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