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SiC/Cu composite prepared by spontaneous infiltration of copper alloy into porous SiC ceramic
  • ISSN号：0255-5476
  • 期刊名称：Materials Science Forum
  • 时间：2015.6.8
  • 页码：569-573
  • 相关项目：Ni-Si(-C)合金与碳化硅的非反应润湿与界面结合机理
作者： Kuo Zhang|Zhongqi Shi|Guiwu Liu|Guanjun Qiao|
同期刊论文项目
Ni-Si(-C)合金与碳化硅的非反应润湿与界面结合机理
期刊论文 14 会议论文 1 专利 2
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