采用硬晶片的三维堆叠SoC测试规划是一个NP hard问题,针对该问题提出了一种采用GWO(grey wolf optimization)的三维堆叠SoC测试规划方法,使得在最大测试引脚数和最大可使用TSV(through silicon vias)数的约束条件下,从而达到三维堆叠SoC测试时间最小化目的。本算法基于群体智能,通过实施攻击等操作,更新Alpha、Beta和Delta进行寻优,从而实现三维堆叠SoC测试规划。本研究以ITC'02 Test benchmarks中的典型SoC为实验堆叠对象,实验结果表明本算法相比PSO(particle swarm optimization),能够获得更短的测试时间。
Test scheduling of three-dimensional stacked SoC is a NP hard problem. This paper proposes a GWO ( grey wolf optimization) algorithm for the three-dimensional test scheduling, which can achieve the purpose of min- imization of test time of the three-dimensional integrated circuit under the condition of the maximum number of TSV available and the maximum number of test pins available. Through the implementation of attack operation, the algo- rithm based on swarm intelligence can achieve the test scheduling of three-dimensional stacked SoC. Typical SoC in ITC02 benchmark is adopted, and the experimental results show that the algorithm can obtain shorter test time com- pared with PSO (particle swarm optimization).