中文摘要：

液氮冲击中InSb面阵探测器表面经常出现局部分层、开裂等失效模式.为明晰材料分层、光敏元芯片断裂过程,基于三维等效建模设想,在易分层处添加内聚区模型,合理选取界面分层开裂参数,建立了128×128InSb探测器结构分层模型.模拟结果涵盖了典型碎裂照片中呈现的所有形变信息,即1）在光敏元阵列区域,复现出典型棋盘格屈曲模式;2）在Negative电极区域上方,InSb芯片与下层材料逐渐分开,且分层向两侧逐步扩展;3）在面阵探测器周边区域,表面起伏相对平整.上述模拟结果证明了所建分层模型的正确性和参数选取的合理性,为后续裂纹起源、传播过程的研究提供了模型基础.

英文摘要：

Local interfacial delamination and cracking, appearing in the top surface of InSb infrared focal plane arrays （IRF- PAs）, are typical failure patterns observed in liquid nitrogen shock tests. In order to explore the delamination mechanism and cracking process, based on the thought of three-dimensional equivalent modeling, we employ the cohesive zone model （CZM） for the interface where delamination appears most easily, and create the structural model of 128~ 128 InSb IRF- PAs. Simulation results contain all the deformation characteristics appearing in the typical optical fracture photographs. That is, firstly, in the photosensitive element array, the global square checkerboard buckling pattern reappears; secondly, in the negative electrode material, the InSb chip is gradually separated from the negative electrode, and the width of delamination is widened gradually; thirdly, on the periphery of InSb IRFPAs, the surface is flat. All these findings sug- gest that the model created in this paper is correct, and the parameters selected are suitable. Based on the delamination model, it is possible to find the initiation and propagation rule of cracks in the research that follows.