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A wafer-level Sn-rich Au–Sn intermediate bonding technique with high strength,
  • ISSN号：0960-1317
  • 期刊名称：Journal of Micromechanics and Microengineering
  • 时间：2013
  • 页码：095008-
  • 相关项目：集成微流道的微谐振梁生物传感器及其在肿瘤标志物检测中的应用
作者： Zhiqiang Fang|Xu Mao|Jinling Yang|Fuhua Yang|
同期刊论文项目
集成微流道的微谐振梁生物传感器及其在肿瘤标志物检测中的应用
期刊论文 12 会议论文 1
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