中文摘要：

概括了微机电系统的发展状况，分析了各种键合技术方法的优缺点及阳极键合技术今后的发展方向。探讨了微晶玻璃作为良好的封装材料或键合材料的可行性，同时介绍了课题的研究内容、研究目标以及技术路线。课题的实施对于拓展阳极键合技术的应用领域、开辟微晶玻璃材料新的应用途径、推动微机电系统的发展具有重要的意义。

英文摘要：

Development of the microelectromechanical systems （MEMS） was summarized. The bonding technologies were analyzed. The direction of anodic bonding technology was pointed out. Glass-ceramics used as packaging materials and anodic bonding materials were studied. The research method, content and target were described.