中文摘要：

为实现KDP、CZT等光学元件用软脆功能晶体坯料的精密切割,研究了悬砂法制备电镀金刚石微粉磨料线锯工艺方法,通过扫描电镜形貌观测,试验分析了不同电流密度、电镀时间和金刚石悬浮量条件下制备的线锯样件质量,探讨了工艺参数对线锯电镀质量的影响及缺陷产生的原因。试验结果表明,悬砂法制备金刚石微粉磨料线锯能够克服埋砂法存在的微粉磨粒分散性差、易导致连续运动的丝线挂砂困难等问题,在合理的工艺参数条件下能够获得磨料分布均匀的电镀金刚石微粉磨料丝线。

英文摘要：

The sand-suspend-electroplating technique for diamond micro powder wire saw fabricating is developed to realize precision sawing of optical crystals with soft and brittle characters such as KDP,CZT and other optical components.The effect of parameters such as cathode current density,electroplating time and abrasive concentration on the electroplating quality of the wire saw was experimentally analyzed by the SEM.The forming mechanism of the produced defects in composite electroplating process was discussed.The xperimental results show that the problems of aggregating of micro diamond grits and difficult to take the micro grits on the wire in continuously moving process can be solved by the sand-suspend-electroplating technique developed.The uniform distribution of the abrasive diamond grits on the wire saw can be obtained with reasonable electroplating process parameters.