使用溶胶-凝胶法在硅片衬底上制备出不同浓度Tb3+掺杂的Zn Al2O4∶Tb3+薄膜,使用X射线衍射(XRD)、热重-示差扫描量热(TG-DSC)、扫描电镜(SEM)以及荧光光谱分析(PL)进行了表征。结果表明,在700℃煅烧温度下得到的Zn Al2O4∶Tb3+薄膜能够形成良好的锌铝尖晶石物相。700℃煅烧所得样品以薄膜形态附着在硅片衬底上,薄膜表面存在小尺寸裂纹,且与衬底之间附着良好。在232 nm紫外光激发下,样品的发射光谱由位于489 nm、543 nm、587 nm和620 nm的四个发射峰组成,分别对应Tb3+的5D4→7FJ(J=6,5,4,3)的跃迁,并且当Tb3+掺杂浓度为5at%时,样品的发光强度达到最大值,继续增加Tb3+浓度,则会发生浓度猝灭现象,发光强度降低。
Tb3 +-doped Zn Al2O4 thin films were prepared by sol-gel method on silicon wafers. The properties of Zn Al2O4∶ Tb3 +films were characterized by X-ray diffraction( XRD),thermogravimetry and differential scanning calorimetry( TG-DSC),scanning electron microscopy( SEM) and photoluminescence spectrum( PL). The results show that the films attached on the silicon wafers are flaked with a good adhesion after the films are calcined at 700 ℃. The emission spectrum consists of four characteristic emission of Tb3 +at 489 nm(5D4→7F6),543 nm(5D4→7F5),587 nm(5D4→7F4),620 nm(5D4→7F3),respectively. The Zn Al2O4∶ Tb3 +thin films revealed that the strongest emission intensity is at543 nm when the Tb3 +concentration reaches 5at%,and that the concentration quenching will occur when Tb3 +concentration increases.