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Quad-cantilever microsensors with a low-cost single-sided micro-machining technique for trace chemic
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  • 相关项目：半导体敏感器件和半导体传感器
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半导体敏感器件和半导体传感器
期刊论文 36 会议论文 29
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Single-Side Fabricated Pressure Sensors for IC-Foundry Compatible High-Yield and Low-Cost Volume Pro
Giant piezoresistance of p-type nano-thick silicon induced by interface electron-trapping instead of
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Microcantilever Probe Cards With Silicon and Nickel Composite Micromachining Technique for Wafer-Lev
A wide-range tunable on-chip radio-frequency LC-tank formed with a post-CMOS-compatible MEMS fabrica
Resonance-mode effect on microcantilever mass-sensing performance in air
Bio/chemical detection in liquid with self-sensing Pr-Oxi-Lever (piezo-resistive SiO2 cantilever) se
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Post-CMOS Compatible Micromachining Technique for On-Chip Passive RF Filter Circuits
Single-Wafer-Processed Self-Testable High-g Accelerometers With Both Sensing and Actuating Elements
Nano-thick resonant cantilevers with a novel specific reaction-induced frequency-increase effect for
A micromachining technology for integrating low-loss GHz RF passives on non-high-resistivity low-cos
Three-solenoid windings transformer baluns on CMOS-grade silicon substrate
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A High-Performance Dual-Cantilever High-Shock Accelerometer Single-Sided Micromachined in (111) Sili
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Functionalized Mesoporous Silica for Microgravimetric Sensing of Trace Chemical Vapors
Giant piezoresistance measured in n-type nano-thick Si-layer that has interface with SiO2
TPMS (Tire-pressure Monitoring System) Sensors: Monolithic Integration of Surface-micromachined Piez
On-chip micromachined solenoid balun for RF-SOC applications
MEMS Vertical Probe Cards With Ultra Densely Arrayed Metal Probes for Wafer-Level IC Testing
Nanogram per milliliter-level immunologic detection of alpha-fetoprotein with integrated rotating-re
(Topic Review Paper) Integrated micro-cantilevers for ultra-resoluble sensing and probing
A chelating-bond breaking and re-linking technique for rapid re-generation of immune biosensors
Enhanced Solder Joint Bonding Strength of Electronic Packaging with Electrowetting Effect
Bi-stable frequency up-conversion piezoelectric energy-harvester driven by non-contact magnetic repu
Silicon cantilever arrays with by-pass metal through-silicon-via (TSV) tips for micromachined IC tes
On-chip integration of acceleration, pressure and temperature composite sensors with a single-sided
A dynamic collision model for improved over-range protection of cantilever-mass micromechanical acce
Micro/Nano-combined Gas Sensors with Functionalized Mesoporous Thin-film Self-assembled in Batches o
服务于IC产业的MEMS探卡
服务于微电子产业的MEMS新技术