中文摘要：

通过分析银铜颗粒表面铜与氧的反应，计算银铜合金中铜的沉淀析出量、铜在银基体中的扩散速率以及CuO颗粒大小，研究了反应合成AgCuO复合材料中CuO的长大动力学行为．结果表明：在反应合成制备过程中，氧化铜颗粒长大动力学行为满足抛物线规律；银铜合金表面铜与氧的反应是一种铜扩散控制型反应，该氧化铜颗粒的长大与铜在银铜合金中的含量、扩散速率和所处位置（晶内、晶界）有关．计算得到的CuO颗粒大小与实际获得的氧化铜颗粒大小相吻合．

英文摘要：

The growth kinetics behaviors of CuO particles in reactive synthesis AgCuO composites were investigated by analyzing the reaction of copper and oxygen on the surface of a silver-copper alloy and calculating the precipitation amount of copper in the silvercopper alloy, the diffusion rate of copper in silver matrix and the size of CuO particles. It is indicated that the growth kinetics of CuO particles in the reactive synthesis process follows a parabolic law, the reaction of copper and oxygen on the surface of the silver-copper alloy is controlled by copper diffusion, and the growth of CuO particles is influenced by the content, diffusion rate and location （ grains or grain boundaries） of copper in the silver-copper alloy. The calculated size of copper oxide particles agrees with the measured one.