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Investigation of mutual cross-correlation between integrated chip topography modelling and its image
  • ISSN号：1753-3465
  • 期刊名称：International Journal of Computational Materials S
  • 时间：2013.2.20
  • 页码：154-175
  • 相关项目：超高速研磨多相微尺度湍流应力机理与边界层激波破坏研究
作者： Z.W. Liang|X C. Liu|B Y. Ye|
同期刊论文项目
超高速研磨多相微尺度湍流应力机理与边界层激波破坏研究
期刊论文 24 获奖 10 专利 1
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