位置：成果数据库 > 期刊 > 期刊详情页
Electrochemical behavior of copper in the (NaCl-KCl-CuCl) molten salt
  • 期刊名称：Acta Metalurgical Sinica (English letters)
  • 时间：2011.12.12
  • 页码：466-472
  • 相关项目：熔盐电化学法制备W/Cu功能梯度材料的基础研究
作者： Li Yungang|Li Jie|Zhang Kuai|Liu Limin|
同期刊论文项目
熔盐电化学法制备W/Cu功能梯度材料的基础研究
期刊论文 16 会议论文 1
同项目期刊论文
Electrochemical Behavior of Copper in the (NaCl-KCl-CuCl2) Molten Salt
Electrochemical behavior of silicon compound in LiF-NaF-KF-Na2SiF6 molten salt
Ultrafine W-Cu Composite Powder Research Progress
Influence of Pulse Electrodeposition Parameters on Thickness of Boronized Layer by Orthogonal Test
Effect of Current Density on Composition and Microstructure of Boronized Layer by Electrodeposition
Effect of Frequency on Composition and Microstructure of Siliconized Layer Using Pulse Electrodeposi
Growth Kinetics and Microstructure of Siliconized Layer by Molten Salt Electrodeposition
Electrochemical behavior of tungsten in (NaCl–KCl–NaF–WO3 )molten salt
Electrochemical Behavior of Tungsten in the (NaCl-KCl-NaF-Na2WO4) Molten Salt
W-Cu功能梯度材料的研究现状
Effect of the Duty Cycle on Boronized Layer Formed by Pulse Electrodeposition
Growth Characteristics of Pulse Electrodeposition Fe-Si layer
Preparation of High Silicon Steel by Pulse Electrodeposition in Molten Salt
金属扩散系数的测量方法与理论研究
铜基镀镍工艺研究