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Dry micro-grooving on Si wafer using a coarse diamond grinding
ISSN号:0890-6955
期刊名称:International Journal of Machine Tools and Manufac
时间:2012.10.10
页码:1-8
相关项目:微沟槽功能曲表面的双空间精密机械加工研究
作者:
Xie, J.|Xie, H. F.|Liu, X. R.|Tan, T. W.|
同期刊论文项目
微沟槽功能曲表面的双空间精密机械加工研究
期刊论文 20
会议论文 5
获奖 4
专利 3
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