中文摘要：

以银铜合金为靶材，利用辉光等离子体在AISI304不锈钢表面同时渗入银和铜，制备性能优良的抗菌不锈钢。对渗层的形貌、化学组成、耐蚀性能和抗菌性能进行了研究，结果表明，所得渗层在不锈钢表面分布均匀，Ag／Cu元素质量比为4．9：3；不锈钢表面渗层腐蚀电位由-0．103V提高到0．07V，自腐蚀电流密度从1．66×10^-7A／cm^2降至5．813×10^-9A／cm^2，耐腐蚀性能有所提高；渗层对大肠杆菌和金黄色葡萄球菌的杀菌率均达100％。

英文摘要：

AISI304 stainless steel doped by silver and copper ions simultaneously with glow discharge plasma metallurgy was prepared. The antibacterial properties of Ag/Cu doped stainless steel were estimated by standard plate count method. The doped layer was characterized by energy dispersive X-ray spectrometry（EDS）. The corrosion resistance of Ag/Cu doped stainless steel was evaluated by electrochemical polarization curve in 3.5wt% NaC1 solution. The results show that the weight ratio of silver and copper ions existed in the doped layer of stainless steel is 4. 9 ： 3. The corrosion potential of the layer increase from -0. 103V to 0. 07V. The corrosion current densities decrease from 1.66×10^-7A/cm^2 to 5.813×10^-9A/cm^2. The corrosion resistance of stainless steel is enhanced after doped with copper and silver ions. Excellent antibacterial activities （100%） against both Gram-negative Escherichia coli and Grampositive Staphylococcus aureus are obtained for Ag/Cu doped stainless steel.