中文摘要：

铜离子被金属蒸汽真空弧与 100 keV 的一个精力和一个离子剂量范围植入进奥氏体的不锈钢(SS )(0.5 8.0 ) × 1017 厘米 ? 2。植入 Cu 的 SS 在一个 Ar 空气炉子被退火。看一眼的 X 光检查衍射(GXRD ) ，传播电子显微镜学(TEM ) 和钻电子光谱学(AES ) 被用来在植入的层揭示铜离子的阶段作文，微观结构，和集中侧面。结果证明植入 Cu 的 SS 的抗菌剂性质被归因于 Cu9.9Fe0.1，它作为针猛抛。在有退火的植入 Cu 的 SS 的铜的深度没有退火，处理在植入 Cu 的 SS 比那大处理，它对 S 改进抗菌剂性质。aureus。弄湿弄干联合周期的测试的盐被用来评估抗菌剂 SS 的腐蚀抵抗，并且结果表明抗菌剂 SS 有等价于未植入的 SS 的腐蚀抵抗的水平。

英文摘要：

Copper ions were implanted into austenitic stainless steel （SS） by metal vapor vacuum arc with a energy of 100 keV and an ions dose range of （0.5-8.0）× 10^17 cm^-2. The Cu-implanted SS was annealed in an Ar atmosphere furnace. Glancing X-ray diffraction （GXRD）, transmission electron microscopy （TEM） and Auger electron spectroscopy （AES） were used to reveal the phase compositions, microstructures, and concentration profiles of copper ions in the implanted layer. The results show that the antibacterial property of Cu-implanted SS is attributed to Cu9.9Fe0.1, which precipitated as needles. The depth of copper in Cu-implanted SS with annealing treatment is greater than that in Cu-implanted SS without annealing treatment, which improves the antibacterial property against S. aureus. The salt wetting-drying combined cyclic test was used to evaluate the corrosion-resistance of antibacterial SS, and the results reveal that the antibacterial SS has a level of corrosion-resistance equivalent to that of un-implanted SS.