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Room temperature creep behavior of free-standing Cu films with bimodal grain size distribution
  • ISSN号：1359-6462
  • 期刊名称：Scripta Materialia
  • 时间：2013.2.12
  • 页码：849-852
  • 相关项目：铜基异构纳米金属多层膜变形机制与加工硬化行为研究
作者： Zhang, J.Y.|Cheng, P.M.|Liu, G.|Sun, J.|
同期刊论文项目
铜基异构纳米金属多层膜变形机制与加工硬化行为研究
期刊论文 22
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