中文摘要：

提出并建立了一种基于方块电阻测量的原位表征Cu薄膜氧化反应动力学规律的方法.利用Cu薄膜方块电阻随氧化时间的变化情况,得到氧化产物厚度与氧化时间的关系,反应动力学表征结果符合抛物线规律.还利用不同的氧化反应温度条件和对应的抛物线常数之间的关系得到体系的扩散激活能.结果表明,提出的表征方法适用于Cu薄膜氧化反应体系.

英文摘要：

　In this paper,a new in situ method was developed for characterizing the kinetics of the oxidation process of copper thin films by using sheet resistance.Copper thin films were prepared on glass substrate by vacuum deposition.The oxidation kinetics of the copper thin films was studied via sheet resistance which increased during the process.The results suggested that this new method can be applied to the characterization of the reaction kinetics of copper thin film.