中文摘要：

研究了施加稳恒磁场（0～1T）对电镀Ni—W合金的影响。测定不同方向、不同强度稳恒磁场下的电流效率、合金组成及镀层的耐蚀性，并用扫描电镜和X射线衍射对镀层的微观形貌及结构进行了观察和分析。对实验结果进行了分析讨论，找出稳恒磁场对这些性能指标的影响规律。结果表明：与不施加磁场相比，施加磁场后镀层的表面更均匀、细致、平整；镀层的含钨量上升：当B⊥J，B=1．0T时，含钨量上升了约7％；当B∥J，B=1．0T时，含钨量上升了约9％；镀膜的非晶化程度增强；镀膜的耐蚀性提高；但Ni—W合金电镀的电流效率降低。

英文摘要：

The effects of stabilized magnetic field （0- 1 T） on electroplating nickel-tungsten alloy films were studied. The current efficiency, composition and corrosion resistance of nickel-tungsten alloy films electroplated in different direction and intensity magnetic fields were tested respectively. The micro-morphology of films was observed under scanning electron microscope and the structure was analyzed by X-ray diffractrometry. The influence rules of stabilized magnetic field on performances of nickel-tungsten alloy films were obtained according to experimental data. The results show that the films electroplated in stabilized magnetic field are more homogeneous and smooth and the content of tungsten in films increases to 7 % （B⊥J, B= 1.0 T） and 9 %（B//J, B = 1.0 T） respectively compared with those electroplated without applying magnetic field. The corrosion resistance and amorphism of electroplated films also increases, while the current efficiency of plating solution decreases in magnetic field.