中文摘要：

采用注射成型方法制备了SiCp封装盒体的预成型坯，用压力浸渗方法将熔融铝浸渗到SiC，封装盒体的预成型坯中，制备出含SiCp体积分数为65％的SiCp／Al复合材料的封装盒体。SEM观察表明，经过压力浸渗后SiCp／Al复合材料组织均匀且致密化高，室温热膨胀系数为8．0×10^-6／K，热导率接近130w／（m·K），密度为2．98g／cm^3，能够很好地满足电子封装的要求。

英文摘要：

The SiCp preformed compact was prepared by Powder Injection Molding （PIM）, and the melting aluminum penetrated into the SiCp preformed compact by the pressure infiltration method to manufacture the electronic package box of SiCp （ 65 % ）/Al composites. SiCp （ 65 % ）/Al composite manufactured by pressure infiltration has high density and homogeneous microstructure. The density of the composite is 2.98 g/cm^3 ; the thermal expansion coefficient and thermal conductivity of the composite are 8.0× 10^-6/K and nearly 130 W/（m.K） at room temperature, respectively, which is up to the request of the electronic package.