中文摘要：

采用Sn-2．SAg-2．0Ni焊料钎焊了具有Ni（P）／Ni（B）和Ni（P）／Ni两种双镀层结构的SiCp／Al复合材料．结果表明，SnAgNi／Ni（B）／Ni（P）和SnAgNi／Ni／Ni（P）两种接头均生成唯一的金属间化合物Ni3Sn4．SnAgNi焊料与Ni（B）镀层之间的快速反应速度使Ni3Sn4金属间化合物具有高的生长速度．时效初期的SnAgNi／Ni／Ni（P）接头的剪切强度高于SnAgNi／Ni（B）／Ni（P）接头，但在250h时效后其剪切强度剧烈下降，低于SnAgNi／Ni（B）／Ni（P）接头．金属间化合物的生长及裂纹的形成是SnAgNi／Ni／Ni（P）接头失效的主要原因，而SnAgNi／Ni（B）／Ni（P）接头失效的主要原因是Ni（P）镀层中Ni原子的定向扩散使SiCp／Al复合材料与Ni（P）处产生孔洞．

英文摘要：

An experimental study was presented to evaluate the microstructures and reliability of solder joints between Sn-2.5Ag- 2.0Ni solder and various Ni plating layers. Ni（P）/Ni（B） and Ni（P）/Ni double layers were used to deposit on SiCp/Al composites. The high reaction rate between Ni（B） layer and SnAgNi solder leaded to the highest growth rate of intermetallie compound （IMC） Ni3Sn4. The shear strength of solder joints with Ni（P）/Ni layer is higher than that of solder joints with Ni（P）/Ni（B） layer at the initial stage of aging, but lower than that after 250 h aging. [ntermetallie layer growth and crack formation are the major reasons of failure for a SnAgNi/Ni/Ni（P） solder joint. While the failure of a SnAgNi/Ni（B）/Ni（P） solder joint is caused by the formation of holes between Ni（P） and SiCp/Al composites, which result from directional diffusion of Ni toward solder.