中文摘要：

提出了一种在改性聚氨酯（PuR）材料表面进行金属化的方法。以掺杂了铜基金属复合物粉末的PUR浆料为基体，采用SPI光纤激光器（波长1064nm）对PUR表面进行刻蚀改性，达到传统化学镀铜中粗化和活化的目的，最后进行化学镀铜。对铜镀层进行了结合力、导电性以及延展性测试。结果表明，制备的铜镀层光亮、致密、结合力强、导电性好、延展性优良。通过扫描电子显微镜、x射线能谱仪、x射线光电子能谱（XPS）分析和俄歇电子能谱（XAES）分析对经过激光刻蚀改性的基体表面形貌和成分进行表征。探讨了激光刻蚀改性材料表面后。基体表面上铜元素的价态，分析XPS图谱和XAES图谱发现，激光刻蚀改性后的基体表面上铜元素以Cu＋形式存在。研究了不同激光功率对刻蚀表面粗糙度的影响规律，通过胶带拉力实验验证了基体表面形貌与镀层结合强度的关系，实验结果表明，当用功率为7w的激光刻蚀基体表面时，材料表面粗糙度值最大，并且其镀层结合力也最强。

英文摘要：

A method ofmetallization on modified polyurethane（PUR） surface was presented. To achieve coarse and activation effect as in the process of the traditional electroless copper plating, SPI fiber laser（wavelength 1064 nm） was used to etch and modify PUR surface, which was prepared by doping copper-based metal composite powder to PUR slurry, then submitted to electroless copper plating. Copper plating layer was tested , including adhesion strength, conductivity and ductility. The results indicated that copper plating was bright, compact, with good conductivity and excellent ductility. The composition and morphology of the PUR surface modified by laser etched were characterized by scanning electron microscopy, X-ray energy dispersive spectroscopy, X-ray photoelectron spectroscopy（XPS） and Auger electron spectroscopy（XAES）, respectively. Copper valence of the substrate surface modified by laser etching was investigated. Result of XPS spectrum and XAES spectrum analysis showed that Cu on substrate surface modified by laser etching existed in the form of Cu~. The influence of different laser power on the roughness of the etched surface was studied, and the relationship between the substrate surface morphology and the coating bond strength were verified by experiment of the tape pulling, the result indicated that when the substrate surface was laser etched by laser power 7 W, the surface roughness reached the maximum and coating adhesion was also the strongest.