采用真空熔炼?氩气保护下拉式连续定向凝固技术制备纯铜板材,研究了工艺参数对凝固成形过程的影响,分析了连续定向凝固板材的组织和性能。结果表明:当熔体温度1160℃、下拉速度70mm/min、冷却水量900L/h时,可以连续稳定成形宽25mm、厚5mm且表面光亮、具有连续柱状晶组织的纯铜板材,其抗拉强度为146MPa,屈服强度为33MPa,延伸率为54%,电导率为105.9%IACS,具有优良的力学性能和电学性能。
Pure copper plates were prepared by vacuum melting and argon-shield vertical continuous unidirectional solidification process. The effects of process parameters on the solidification forming were investigated, and microstructure and properties of the fabricated plates were analyzed. The results showed that pure copper plates of 25mm in width and 5mm in thickness with luminant surface and columnar crystals can be continuously and stably fabricated under the conditions of melting temperature 1160℃, drawing speed 70mm/min, cooling water volume 900L/h. The pure copper plates with the tensile strength 146MPa, yield strength 33MPa, elongation 54% and conductivity 105.9% IACS showed an excellent mechanical and conductive properties.