位置：成果数据库 > 会议 > 会议详情页
Micropolar Cohesive Zone Model for Delamination Failure in Microsystem Interconnects
  • 所属机构名称：上海大学
  • 会议名称：The 22nd International Congress of Theoretical and Applied Mechanics
  • 成果类型：会议
  • 会场：Adelaide
  • 相关项目：微系统连接界面分层失效的实验和微极模型研究
作者： Fan, Jing-yu|Ragnar Larsson|Zhang, Yan|
同会议论文项目
微系统连接界面分层失效的实验和微极模型研究
期刊论文 9 会议论文 17
同项目会议论文
包含尺度效应的界面可靠性模型研究
Study of the Filler Effect on the Effective Thermal Conductivity of Thermal Conductive Adhesive
Numerical Investigation on the Thermal Properties of the Micro-Cooler
MDS Investigation on the Heat Transfer Properties of CNT Micro-Channel Cooler
Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropo
采用纳米流体的微通道冷却器散热特性研究
A study of the Heat Transfer Characteristics of the Micro-Channel Heat Sink
Influences of Filler Geometry and Content on Effective Thermal Conductivity of Thermal Conductive Ad
基于碳纳米管技术的新型微通道冷却器研究
微系统封装高密度互连界面行为的实验和微极模型研究
Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Th
Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-
Modeling of Heat Transfer Performance for an Array of Micro Jets Impinging upon Dimpled Surface
Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA
Effect of Encapsulation on OLED Characteristics with Anisotropic Conductive Adhesive
MDS Study on the Adhesive Heat Transfer in Micro-Channel Cooler