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Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-
  • 所属机构名称：上海大学
  • 会议名称：International Conference on Electronic Packaging Technology and High Density Packaging
  • 成果类型：会议
  • 会场：Shanghai, PEOPLES R CHINA
  • 相关项目：微系统连接界面分层失效的实验和微极模型研究
作者： Tao, Wenkai|Zhang, Lili|Zhang, Yan|Liu, Johan|Zhai, Qijie|Cheng, Zhaonian|Gao, Yulai|Andersson, Cristina|
同会议论文项目
微系统连接界面分层失效的实验和微极模型研究
期刊论文 9 会议论文 17
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