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Numerical Simulation of Solder Spreading and Solidification during Solder Jet Bumping Process
  • 所属机构名称：哈尔滨工业大学
  • 会议名称：2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT
  • 成果类型：会议
  • 相关项目：含有限晶粒的电子封装微连接接头的微观力学行为
作者： Yanhong Tian|Chunqing Wang|Dewen Tian|
同会议论文项目
含有限晶粒的电子封装微连接接头的微观力学行为
期刊论文 8 会议论文 7 专利 1
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