位置：成果数据库 > 会议 > 会议详情页
Achieving high-performance bulk silicon electrothermal actuator on CMOS substrate
  • 所属机构名称：东南大学
  • 会议名称：4th International Conference on Mechanical and Electrical Technology, ICMET 2012
  • 时间：2012
  • 成果类型：会议
  • 相关项目：基于光斑位置敏感的风速传感器集成系统研究
作者： Cai, Chun-Hua|Qin, Ming|
同会议论文项目
基于光斑位置敏感的风速传感器集成系统研究
期刊论文 11 会议论文 8 获奖 2 专利 12
同项目会议论文
Measurement of the magnitude and direction of magnetic field by a micromachined cantilever
Wafer level packaging based on AU-AU bonding for a CMOS compatible thermal wind sensor
A MEMS Pressure Sensor Based on Hall Effect
A MEMS capacitive pressure sensor compatible with CMOS process
High performance bulk silicon comb-drive actuator based on post-CMOS process
A Novel Approach for Achieving Bulk Silicon MEMS on CMOS Substrate by Au-Au Bonding
A Hot Film Wind Sensor with Four Constant Temperature Difference Elements Fabricated on Ceramic Subs