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A Novel Approach for Achieving Bulk Silicon MEMS on CMOS Substrate by Au-Au Bonding
  • 所属机构名称：东南大学
  • 会议名称：IEEE Conference on Sensors
  • 时间：2011
  • 成果类型：会议
  • 相关项目：基于光斑位置敏感的风速传感器集成系统研究
作者： Cai, Chun-Hua|Qin, Ming|
同会议论文项目
基于光斑位置敏感的风速传感器集成系统研究
期刊论文 11 会议论文 8 获奖 2 专利 12
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