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Wafer level packaging based on AU-AU bonding for a CMOS compatible thermal wind sensor
  • 所属机构名称：东南大学
  • 会议名称：2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
  • 时间：2011
  • 成果类型：会议
  • 相关项目：基于光斑位置敏感的风速传感器集成系统研究
作者： Dong, Ziqiang|Qin, Ming|Chen, Jingjing|Qin, Yukun|Huang, Qing-An|
同会议论文项目
基于光斑位置敏感的风速传感器集成系统研究
期刊论文 11 会议论文 8 获奖 2 专利 12
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