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High speed deformation measurement of electronic packages by the digital image correlation method
  • 所属机构名称：北京工业大学
  • 成果类型：会议
  • 相关项目：移动微系统封装中无铅焊锡接点的跌落／冲击可靠性设计方法研究
同会议论文项目
移动微系统封装中无铅焊锡接点的跌落／冲击可靠性设计方法研究
期刊论文 10 会议论文 10 获奖 1
同项目会议论文
A Smoothening Algorithm for Strain Measurement by Digital Image Correlation Method
Strain rate effect and Johnson-Cook models of lead-free solder alloys
A Scale Reduced Computation Scheme for Peeling Stress of Solder Joints under Drop Impact.
Dynamic Bending Tests and Numerical Simulation of Board Level Electronic Package
SHPB tests for mechanical behavior of lead-free solder alloys
Dynamic Behavior Tests of Lead-free Solders at High Strain Rates by the SHPB Technique
Dynamic stress of solder joints under board-level drop/impact
Fracture simulation of solder joints by a lattice model
板级电子封装跌落/冲击中焊点的动力响应