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Dynamic Bending Tests and Numerical Simulation of Board Level Electronic Package
  • 所属机构名称：北京工业大学
  • 成果类型：会议
  • 相关项目：移动微系统封装中无铅焊锡接点的跌落／冲击可靠性设计方法研究
同会议论文项目
移动微系统封装中无铅焊锡接点的跌落／冲击可靠性设计方法研究
期刊论文 10 会议论文 10 获奖 1
同项目会议论文
A Smoothening Algorithm for Strain Measurement by Digital Image Correlation Method
High speed deformation measurement of electronic packages by the digital image correlation method
Strain rate effect and Johnson-Cook models of lead-free solder alloys
A Scale Reduced Computation Scheme for Peeling Stress of Solder Joints under Drop Impact.
SHPB tests for mechanical behavior of lead-free solder alloys
Dynamic Behavior Tests of Lead-free Solders at High Strain Rates by the SHPB Technique
Dynamic stress of solder joints under board-level drop/impact
Fracture simulation of solder joints by a lattice model
板级电子封装跌落/冲击中焊点的动力响应