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板级电子封装跌落/冲击中焊点的动力响应
  • 所属机构名称：北京工业大学
  • 会议名称：第16届全国结构工程学术会议论文集. 2007年10月，山西太原，Volume I：182-185
  • 成果类型：会议
  • 相关项目：移动微系统封装中无铅焊锡接点的跌落／冲击可靠性设计方法研究
同会议论文项目
移动微系统封装中无铅焊锡接点的跌落／冲击可靠性设计方法研究
期刊论文 10 会议论文 10 获奖 1
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