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Effect of thermal cycling on interfacial IMCs growth and fracture behavior of SnAgCu/Cu joints
  • 所属机构名称：北京工业大学
  • 会议名称：2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-H
  • 成果类型：会议
  • 会场：Beijing, China
  • 相关项目：组织与性能的非均匀性对SnAgCu/Cu界面区损伤行为与机理影响的研究
作者： Fenghui, Li|Xiaoyan, Li|
同会议论文项目
组织与性能的非均匀性对SnAgCu/Cu界面区损伤行为与机理影响的研究
期刊论文 10 会议论文 5 获奖 2
同项目会议论文
Failure behavior and life prediction of through-hole solder joints under thermal cycling
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Fracture damage micro-mechanism of SnAgCu/Cu solder joint