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Failure behavior and life prediction of through-hole solder joints under thermal cycling
  • 所属机构名称：北京工业大学
  • 会议名称：2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, IC
  • 成果类型：会议
  • 会场：Xi';an, China
  • 相关项目：组织与性能的非均匀性对SnAgCu/Cu界面区损伤行为与机理影响的研究
作者： Yan, Yongchang|Liu, Na|Xiao, Hui|Li, Xiaoyan|
同会议论文项目
组织与性能的非均匀性对SnAgCu/Cu界面区损伤行为与机理影响的研究
期刊论文 10 会议论文 5 获奖 2
同项目会议论文
IMC';s growth behavior and the characterization of its size during isothermal aging
A damage model for SnAgCu solder under thermal cycling
Fracture damage micro-mechanism of SnAgCu/Cu solder joint
Effect of thermal cycling on interfacial IMCs growth and fracture behavior of SnAgCu/Cu joints