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Vertical Interconnects Squeezing in Symmetric 3D Mesh Network-on-Chip
  • 所属机构名称：中国科学院计算技术研究所
  • 会议名称：IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC)
  • 时间：2011.1.1
  • 成果类型：会议
  • 相关项目：三维芯片中硅直通孔和晶片电路的测试技术研究
作者： Cheng Liu|Lei Zhang|Yinhe Han*|Xiaowei Li|
同会议论文项目
三维芯片中硅直通孔和晶片电路的测试技术研究
期刊论文 13 会议论文 13 专利 3
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