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A Vacuum Sucking Approach to Prevent Chips from Attaching to Machined Surface in Cutting of KDP Crys
  • 所属机构名称：哈尔滨工业大学
  • 成果类型：会议
  • 相关项目：各向异性软脆功能晶体高效精密和超精密加工技术基础
同会议论文项目
各向异性软脆功能晶体高效精密和超精密加工技术基础
期刊论文 56 会议论文 15 获奖 1
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