位置：成果数据库 > 会议 > 会议详情页
潮湿扩散及湿热应力对叠层封装件可靠性影响
  • 所属机构名称：桂林电子科技大学
  • 成果类型：会议
  • 相关项目：微电子封装中的界面层裂失效和界面强度可靠性设计方法研究
作者： 秦连城|叶安林|康雪晶|
同会议论文项目
微电子封装中的界面层裂失效和界面强度可靠性设计方法研究
期刊论文 27 会议论文 15 专利 1 著作 2
同项目会议论文
University education curriculum and lab construction on microelectronics packaging and assembly
叠层芯片封装元件热应力分析及焊点寿命预测
以均匀设计法对SCSP器件工艺参数的优化
微电子封装界面强度的复合模式弯曲测试
热应力影响下SCSP器件的界面分层
Reliability Modeling on a MOSFET Power Package Based on Embedded Die Technology
Introduction of Microelectronics Manufacturing Engineering into Professional Education: a Joint Effo
Optimization of Interface Strength for SCSP Based on Uniform Experimental Design
Optimization of the fatigue life of epoxy molding compounds based on BP neural network prediction mo
Optimization design for packaging device QFN using a prediction model of the neural-genetic algorith
Characterization, modelling, and parameter sensitivity study on electronic packaging polymers
Characterization, modelling, and parameter sensitivity study on electronic packaging polymers
Prediction of die failure in copper-low-k flip chip package with consideration of packaging process-
An optimum design method for nonlinear system using an improved neural network