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叠层芯片封装元件热应力分析及焊点寿命预测
  • 所属机构名称：桂林电子科技大学
  • 成果类型：会议
  • 相关项目：微电子封装中的界面层裂失效和界面强度可靠性设计方法研究
作者： 康雪晶|秦连城|
同会议论文项目
微电子封装中的界面层裂失效和界面强度可靠性设计方法研究
期刊论文 27 会议论文 15 专利 1 著作 2
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