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Through-Silicon Via (TSV) Capacitance Modeling for 3D NoC Energy Consumption Estimation
  • 所属机构名称：西安电子科技大学
  • 会议名称：Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
  • 时间：2010.11.11
  • 成果类型：会议
  • 相关项目：三维器件结构多内核处理器互连低功耗技术
作者： Cai Jueping|Jiang Peng|Yao Lei|Hao Yue|Li Zan|
同会议论文项目
三维器件结构多内核处理器互连低功耗技术
期刊论文 6 会议论文 7 专利 7 著作 1
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