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Influence of BGA Chip’s Layout on Solder Balls Fatigue Life
  • 所属机构名称：西安电子科技大学
  • 会议名称：2014 15th International Conference on Electronic Packaging Technology and High Density Packaging, IC
  • 时间：2014.8.12
  • 成果类型：会议
  • 相关项目：基于屈曲的低压高速大变形微驱动器关键技术研究
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基于屈曲的低压高速大变形微驱动器关键技术研究
期刊论文 20 会议论文 11 著作 2
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