位置：成果数据库 > 会议 > 会议详情页
Optimized design of signal crosstalk in high speed PCB
  • 所属机构名称：西安电子科技大学
  • 会议名称：2012 International Conference on Electronic Packaging Technology & High Density Packaging
  • 时间：2012.10.15
  • 成果类型：会议
  • 相关项目：基于屈曲的低压高速大变形微驱动器关键技术研究
同会议论文项目
基于屈曲的低压高速大变形微驱动器关键技术研究
期刊论文 20 会议论文 11 著作 2
同项目会议论文
Design of permanent magnet brushless DC motor control system based on dsPIC30F4012
Influence of BGA Chip’s Layout on Solder Balls Fatigue Life
Anti-vibration structure analysis and optimizing on BGA packaging module
Analysis of complex packaging model based on BGA
Analysis of a Double-phase Regulation and an Ultra Wideband Tunable Micro Electromechanical System R
TSV Modeling and Thermal Analysis Based on 3D Package
Effect and experiment of screw locations on BGA viscoplastic fatigue life
基于BGA的复杂电子封装模组仿真分析
Reliability Analysis and Thermal Resistance Degradation of High Power Chip under Harsh Environment
Reliability Analysis of and Experiment Test on SAC305 Solder Balls